 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| this is information on a product in full production. october 2015 docid028400 rev 1 1/15 esdaxxscxy automotive quad-line transil? transient voltage suppressor (tvs) for esd protection datasheet - production data features ? 4 unidirectional transil functions ? 400 w peak pulse power (8/20 s) benefits ? high eos and esd protection levels ? suitable for high density boards ? aec-q101 qualified complies with the following standards: ? iso 10605: c = 150 pf, r = 330 ? 30 kv (air discharge) ? 30 kv (contact discharge) ? iso 10605: c = 330 pf, r = 330 ? 30 kv (air discharge) ? 30 kv (contact discharge) ? iso 7637-2 ? pulse 1: v s = -100 v ? pulse 2a: v s = +50 v ? pulse 3a: v s = -150 v ? pulse 3b: v s = +100 v applications where esd and eos transient overvoltage protection in susceptible equipment is required, such as: ? information - entertainment ? signal communications ? connectivity ? comfort and convenience description the esdaxxscxy devices are monolithic voltage suppressors designed to protect components which are connected to data and transmission lines against esd. they clamp the voltage just above the logic level supply for positive transients, and to a diode drop below ground for negative transient. figure 1. pin configuration 6 2 7 / 6 2 7 / table 1. device summary order code v br (min.) package esda5v3sc6y 5.3 sot23-6l esda6v1sc6y 6.1 sot23-6l esda14v2sc5y 14.2 sot23-5l ESDA14V2SC6Y 14.2 sot23-6l esda25sc6y 25 sot23-6l 6 2 7 / 6 2 7 / www.st.com
characteristics esdaxxscxy 2/15 docid028400 rev 1 1 characteristics figure 2. electrical characteristics (definitions) table 2. absolute ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage iso10605 (c = 150 pf, r = 330 ) contact discharge air discharge iso10605 (c = 330 pf, r = 330 ) contact discharge air discharge 30 30 30 30 kv p pp peak pulse power (8/20s) esda5v3sc6y, esda6v1sc6y 300 w esda14v2sc5y, ESDA14V2SC6Y, esda25sc6y 400 i pp peak pulse current (8/20s) esda5v3sc6y esda6v1sc6y esda14v2sc5y, ESDA14V2SC6Y esda25sc6y 22 18 14 9 a t j operating junction temperature range -40 to +150 c t stg storage temperature range -65 to +150 c t l maximum lead temperature for soldering during 10 s 260 c 6 \ p e r o 3 d u d p h w h u 9 % u h d n g r z q y r o w d j h , / h d n d j h f x u u h q w # 9 9 6 w d q g r i i y r o w d j h 9 & o d p s l q j y r o w d j h , 3 h d n s x o v h f x u u h q w % 5 5 0 5 0 5 0 & / 3 3 9 , 9 & / 9 % 5 9 5 0 , ) 9 ) , 5 0 , 3 3 6 o r s h 5 g , ) r u z d u g f x u u h q w ) 9 ) r u z d u g y r o w d j h ) 5 ' \ q d p l f l p s h g d q f h g & / , 1 ( / l q h f d s d f l w d q f h docid028400 rev 1 3/15 esdaxxscxy characteristics 15 table 3. electrical characteristics - values (t amb = 25 c) order code v br at i r i rm at v rm v cl at i pp (1) v f at i f t (2) c line min. max. max. max. max. max. typ. vvmaavvavma10 -4 /c pf esda5v3sc6y 5.3 5.9 1 2 3 21 22 1.25 200 5 320 esda6v1sc6y 6.1 7.2 1 2 5.2 19 18 1.25 200 6 190 esda14v2sc5y, ESDA14V2SC6Y 14.2 15.8 1 5 12 35 14 1.25 200 10 100 esda25sc6y 25 30 1 1 24 51 9 1.2 10 10 60 1. 8/20 s waveform 2. v br = t* (t amb - 25 c) * v br (25 c) figure 3. pulse power versus junction temperature figure 4. peak pulse power versus exponential pulse duration (typical values) ? v 3 3 3 : 7 m ? & 3 : s s w ? v s figure 5. clamping voltage versus peak pulse current (typical values, 8/20 s waveform) figure 6. leakage current versus junction temperature (typical values) , $ s s ( 6 ' $ 9 6 & < ( 6 ' $ 6 & < ( 6 ' $ 9 6 & < ( 6 ' $ 9 6 & < ( 6 ' $ 9 6 & < ? v 7 - ? & 9 9 f o ( 6 ' $ 9 6 & < 9 5 9 7 m ? & , 5 q d ( 6 ' $ 9 6 & < 9 5 9 ( 6 ' $ 9 6 & < ( 6 ' $ 9 6 & < 9 5 9 ( 6 ' $ 6 & < 9 5 9 characteristics esdaxxscxy 4/15 docid028400 rev 1 note: iso7637-2 pulse responses are not applicable for products with a breakdown voltage lower than the average battery voltage (13.5 v) like esda6v1sc6y. figure 7. iso7637-2 pulse 1 response (v s = -100 v) figure 8. iso7637-2 pulse 2a response (v s = 50 v) 9 r o w d j h 9 9 r o w d j h ( 6 ' $ 6 & < ( 6 ' $ 6 & < & x u u h q w & x u u h q w $ 7 l p h p v ( 6 ' $ 9 6 & < ( 6 ' $ 9 6 & < ( 6 ' $ 9 6 & < ( 6 ' $ 9 6 & < 9 r o w d j h 9 9 r o w d j h ( 6 ' $ 6 & < ( 6 ' $ 6 & < & x u u h q w & x u u h q w $ 7 l p h ? v 7 l p h ? v ( 6 ' $ 9 6 & < ( 6 ' $ 9 6 & < ( 6 ' $ 9 6 & < ( 6 ' $ 9 6 & < docid028400 rev 1 5/15 esdaxxscxy characteristics 15 figure 9. iso7637-2 pulse 3a response (v s = -150 v) figure 10. iso7637-2 pulse 3b response (v s = 100 v) 9 r o w d j h 9 9 r o w d j h ( 6 ' $ 6 & < ( 6 ' $ 6 & < & x u u h q w & x u u h q w $ 7 l p h ? v 7 l p h ? v ( 6 ' $ 9 6 & < ( 6 ' $ 9 6 & < ( 6 ' $ 9 6 & < ( 6 ' $ 9 6 & < 9 r o w d j h 9 9 r o w d j h ( 6 ' $ 6 & < ( 6 ' $ 6 & < & x u u h q w & x u u h q w $ 7 l p h ? v 7 l p h ? v ( 6 ' $ 9 6 & < ( 6 ' $ 9 6 & < ( 6 ' $ 9 6 & < ( 6 ' $ 9 6 & < application and design guidelines esdaxxscxy 6/15 docid028400 rev 1 2 application and design guidelines more information is available in the stmicroelectronics application note an2689: ?protection of automotive electronics from electrical hazards, guidelines for design and component selection?. docid028400 rev 1 7/15 esdaxxscxy package information 15 3 package information ? epoxy meets ul94, v0 ? lead-free packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. package information esdaxxscxy 8/15 docid028400 rev 1 3.1 sot23-5l package information figure 11. sot23-5l package outline table 4. sot23-5l package mechanical data ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.45 0.0354 0.0570 a1 0 0.15 0 0.0059 a2 0.90 1.30 0.0354 0.0511 b 0.30 0.50 0.0118 0.0196 c 0.09 0.20 0.0035 0.0078 d 2.80 3.05 0.1102 0.1200 e 1.50 1.75 0.0590 0.0688 e 0.95 0.0374 h 2.60 3.00 0.1023 0.1181 l 0.30 0.60 0.0118 0.0236 0 10 0 10 $ $ / + f e ( ' h h $ docid028400 rev 1 9/15 esdaxxscxy package information 15 figure 12. sot23-5l footprint (dimensions in mm) package information esdaxxscxy 10/15 docid028400 rev 1 3.2 sot23-6l package information figure 13. sot23-6l package outline table 5. sot23-6l package mechanical data ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.45 0.0354 0.0570 a1 0 0.15 0 0.0059 a2 0.90 1.30 0.0354 0.0511 b 0.30 0.50 0.0118 0.0196 c 0.09 0.20 0.0035 0.0078 d 2.80 3.05 0.1102 0.1200 e 1.50 1.75 0.0590 0.0688 e 0.95 0.0374 h 2.60 3.00 0.1023 0.1181 l 0.30 0.60 0.0118 0.0236 0 10 0 10 $ $ / + f e ( ' h h $ docid028400 rev 1 11/15 esdaxxscxy package information 15 figure 14. sot23-6l footprint (dimensions in mm) recommendation on pcb assembly esdaxxscxy 12/15 docid028400 rev 1 4 recommendation on pcb assembly 4.1 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. use solder paste with fine particles: powder particle size 20-45 m. 4.2 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead rec ognition capabilities of th e placement system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.3 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks a nd open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. docid028400 rev 1 13/15 esdaxxscxy recommendation on pcb assembly 15 4.4 reflow profile figure 15. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. ? & v ? & ? & v 7 h p s h u d w x u h ? & ? & v ? & v 7 l p h v ? & v v h f p d [ ordering information esdaxxscxy 14/15 docid028400 rev 1 5 ordering information figure 16. ordering information scheme 6 revision history table 6. ordering information order codes marking (1) 1. the marking can be rotated by multiples of 90 to differentiate assembly location package weight base qty delivery mode esda5v3sc6y es5y sot23-6l 14 mg 3000 tape and reel esda6v1sc6y es6y sot23-6l esda14v2sc5y ec1y sot23-5l 16 mg ESDA14V2SC6Y es1y sot23-6l esda25sc6y es2y sot23-6l 14 mg ( 6 ' $ ; ; 6 & ; < ( 6 ' d u u d \ % u h d n g r z q y r o w d j h $ x w r p r w l y h j u d g h 3 d f n d j h 6 & 6 2 7 / 6 & 6 2 7 / table 7. document revision history date revision changes 05-oct-2015 1 initial release. docid028400 rev 1 15/15 esdaxxscxy 15 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2015 stmicroelectronics ? all rights reserved |
Price & Availability of ESDA14V2SC6Y
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |